Phi-Tulip - Multilayer Press

Multilayer Press

PHI Multilayer Presses -- The Industry Standard

For years, PHI has been the world's leading manufacturer of multilayer laminating presses. The exacting mechanical accuracy, exceptionally precise controls and advanced operating features of PHI presses have made these presses the top printed circuit board manufacturers in the world.

PHI's multilayer presses are available with electrically heated platens or steam heated platens.

PHI Multilayer Presses -- Electrically Heated Platens

Electrically heated presses feature PHI's special design platens and digital set point temperature controllers. These controllers feature time proportioning and automatic reset for uniform and predictable platen heating.

Heavy-duty bolsters (insulated from hot platens) and a large diameter ram ensure that deflection is kept to a minimum, and provide lower hydraulic system pressure. The result is reduced hydraulic maintenance requirements.

Selector switches and timers are provided for either manual or automatic operation. Obviously, the more accurately time, temperature and pressure can be controlled, the more consistent and close to perfection the multilayer laminates will be. In these new PHI presses, certain parameters -- time, temperature and pressure -- can be precisely controlled with exceptional accuracy and repeatability. Press operation is far smoother and quieter, and the array of controlling, monitoring and readout components include the most advanced, sensitive and reliable instruments available.

PHI Multilayer Presses -- Steam-Heated Platens

Steam-heated presses come standard with a steam temperature controller, bypass valves, steam traps, inlet and outlet manifolds and all the components required for a complete system.

The controller includes proportional band adjustment (plus automatic reset). It will control each platen to within ± four-degrees of desired set point (in an area one-inch from the platen outer periphery). Presses with steam-heated platens include a digital display of platen temperature. The operator can use the display to monitor individual platen temperature or gauge all platen temperatures automatically in a scanning mode.